Mechanical Engineer

• Develop physical package substrate designs for large form-factor packages for ML high-performance computers (HPCs)
• Develop and implement methodology and CAD flow for efficient substrate design and enhanced productivity
• Manage and drive co-design initiatives across chip, package, and system levels
• Secure production sign-off for package designs
• Collaborate with SI/PI, thermal, mechanical, assembly, and PCB engineering teams
• Refine and optimize product package designs, test vehicles, and mock-up designs for product feasibility
• Manage routing feasibility studies, test vehicle development, product-level designs, design reviews, artwork export, DFM activities, and final manufacturing documentation
• Define and document package substrate design requirements and bill of materials (BOM)
• Contribute to evaluation and adoption of advanced chip packaging technologies
• Support deployment of advanced computing systems in large-scale data center environments and optimize PPA and TCO

Explore Package Design Engineer at SPD Technology. Review requirements and application details.