Senior Thermal Engineer
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Posted: 10/19/2026Senior Thermal Engineer
BLUE ORIGINCore Competencies
Role fitCore Competencies
Use this summary to align your resume positioning with the role.
Demonstrates expertise in thermal design and analysis for aerospace systems, focusing on high-power payloads and associated power electronics. Proficient in thermal modeling, interface management, and compliance with industry standards while mentoring junior engineers and collaborating across multidisciplinary teams.
Highest-signal resume keywords
Thermal Design For Aerospace SystemsThermal Modeling ToolsSpaceborne Thermal DesignThermal Interface TechnologiesCommunication Skills
Tech Stack
Tools & technologiesAbout the role
Key responsibilities & impact- Lead thermal design and analysis for satellite-based, high-power payloads and associated power electronics
- Develop detailed thermal models covering conduction, radiation, and convection using Thermal Desktop, SINDA/FLUINT, or equivalent tools
- Define and manage thermal interfaces across payload subsystems, including radiators, heat pipes, loop heat pipes, cold plates, and structural elements
- Perform transient and steady-state thermal analyses for peak duty cycles, eclipse transitions, and worst-case environmental conditions
- Develop thermal architecture for reusable common bus and payload configurations across production blocks
- Select and defend thermal qualification, margin, and acceptance approaches based on build rate, mission class, and design life
- Define thermal model correlation strategies under limited test data and extend correlated models across production blocks
- Address LEO thermal cycling fatigue across joints, solder, TIMs, and coatings
- Drive design-for-manufacturability of thermal hardware at production rate using parametric or automated modeling workflows
- Evaluate COTS or commercial-grade thermal components where mission class permits
- Manage heater power budgets as fleet-level EPS drivers, trading heater sizing against battery and array mass
- Support design-for-demise and material selection for disposal casualty risk under ODMSP
- Assess manufacturability, cost, and schedule impacts of thermal hardware choices
- Support thermal design and analysis across multiple constellation and payload programs
- Collaborate with payload, mechanical, power, avionics, and systems engineering teams
- Establish thermal requirements, margins, and verification plans aligned with mission reliability and lifetime goals
- Drive thermal design trades balancing performance, mass, power, manufacturability, and cost
- Contribute to major technical design reviews and serve as a technical authority for the thermal system
- Mentor junior engineers and contribute to organizational thermal engineering best practices
Requirements
What you’ll need- Bachelor's degree in mechanical engineering, aerospace engineering, physics, or related field
- 7+ years of experience in thermal engineering for aerospace systems and/or high-performance electronics
- Demonstrated experience with spaceborne thermal design, including vacuum environments, radiation heat transfer, and flight hardware qualification
- Experience with thermal modeling tools such as Thermal Desktop, SINDA/FLUINT, ANSYS Icepak, or equivalent
- Knowledge of materials, coatings, and thermal interface technologies suitable for space systems
- Familiarity with NASA, ESA, and MIL-STD environmental standards and qualification testing
- Exceptional communication skills, with demonstrated ability to influence and guide multidisciplinary teams
- Ability and willingness to obtain and maintain a TS//SCI security clearance
- Must be a U.S. citizen or national, U.S. permanent resident/current Green Card holder, or lawfully admitted into the U.S. as a refugee or granted asylum
- Preferred: Master's or PhD degree in mechanical engineering, aerospace engineering, physics, or related field
- Preferred: Active TS//SCI clearance
- Preferred: Experience supporting capture and proposal efforts for new business opportunities
- Preferred: Background in space-based antenna systems or similar high-power payload systems
- Preferred: Experience managing high-power-density electronics, including T/R modules, phased array apertures, or laser communication terminals
- Preferred: Experience with loop heat pipes, vapor chambers, and liquid cooling systems
- Preferred: Experience on proliferated LEO or other high-rate satellite programs
- Preferred: Experience with thermal cycling, ESS, HALT-HASS-style screening, safety-of-screen, or damage accumulation analysis
Benefits
Comp & perks- Relocation assistance is available for candidates relocating to one of the primary Blue Origin office locations
- Medical, dental, and vision insurance
- Basic and supplemental life insurance
- Paid parental leave
- Short- and long-term disability
- 401(k) with company match of up to 5%
- Education Support Program
- Stock options for all regular employees working at least 20 hours/week
- Up to four weeks of paid time off per year based on weekly scheduled hours
- Up to 14 company-paid holidays
- Potential benefits and bonuses based on role type, job level, individual contributions, and company results; not guaranteed
- Up to 25% travel may be required depending on work location and program needs
ATS Keywords
✓ Tailor your resumeApplicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills
Thermal DesignThermal AnalysisThermal ModelingTransient Thermal AnalysisSteady-State Thermal AnalysisThermal Architecture DevelopmentThermal Qualification ApproachesThermal Cycling Fatigue AssessmentDesign-For-ManufacturabilityHeater Power Budget Management
Soft Skills
Exceptional Communication SkillsMentoringCollaboration
Tools & Technologies
Thermal DesktopSINDA/FLUINTANSYS IcepakCOTS Thermal ComponentsAutomated Modeling Workflows
Certifications & Qualifications
TS//SCI Security Clearance
Industry Keywords
Aerospace EngineeringHigh-Power PayloadsNASA StandardsESA StandardsMIL-STD Environmental StandardsSpace SystemsThermal Interface TechnologiesLEO Thermal CyclingHigh-Power-Density ElectronicsProliferated LEO Programs