Electromechanical Packaging Engineer III – Electro-Optical Components
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Electromechanical Packaging Engineer III – Electro-Optical Components
BLUE ORIGINPosted 10/22/2026full-timeDenver • Colorado • United StatesMid-LevelSenior💰 $119,814 - $167,739 per yearWebsite
Core Competencies
Role fitCore Competencies
Use this summary to align your resume positioning with the role.
Demonstrates expertise in mechanical and thermal design of electro-optical assemblies, with a strong focus on packaging, thermal management, and integration of high-speed digital and photonics components. Proficient in GD&T, tolerance stack-ups, and collaboration with cross-functional teams to ensure high-reliability hardware design.
Highest-signal resume keywords
Mechanical DesignThermal ManagementElectro-Optical Assembly Packaging3D CAD SkillsGD&T Proficiency
Tech Stack
Tools & technologiesAbout the role
Key responsibilities & impact- Own complex packaging assemblies, including enclosures, chassis, card-cage and stacked-unit architectures, mounting systems, and fiber junction housings, from requirements through production support
- Lead mechanical and thermal design of modem processing and photonics units, electro-optic assemblies, optical amplifiers, and transceiver hardware
- Integrate high-speed digital boards, photonics boards, electro-optic daughter cards, and power conversion slices into flight-qualifiable packages
- Own heat rejection paths, mounting materials, heater placement, thermal isolation, and thermal control of temperature-sensitive photonics
- Design fiber-optic trays and internal fiber management, including routing, bend-radius control, strain relief, splice retention, and connector selection
- Define splicing, workmanship, fiber, optical assembly, and electrical harness processes and requirements
- Collaborate with electrical engineers and PCB designers on ECAD/MCAD co-design, board layouts, component placement, connectors, BOM decisions, and board-level protection
- Drive thermal, structural, vibration, shock, fatigue, tolerance stack-up, and thermo-elastic stability analyses
- Lead trade studies balancing mass, thermal and structural performance, EMI/EMC, manufacturability, cost, schedule, and risk
- Own mechanical, thermal, environmental, EMC, mass, and envelope requirements; decompose host requirements and maintain traceability
- Negotiate host vehicle accommodation, mounting interfaces, mass and CG envelopes, thermal limits, and dynamic environment levels
- Deliver models, drawings, specifications, release packages, and mechanical and thermal ICDs using GD&T per ASME Y14.5
- Address contamination control, outgassing, hermeticity, radiation-induced fiber attenuation, radiation, reliability, and long-lead procurement risks
- Apply DFM/DFA and partner with fabrication and assembly suppliers on producibility
- Support testing and integration, including fixtures, optical loopback setups, environmental test campaigns, and anomaly closeout
- Mentor engineers, lead design reviews, establish design standards and analysis methods, and protect classified information and controlled technical data
Requirements
What you’ll need- B.S. in Mechanical, Aerospace, Optical, Photonics Engineering, or a related discipline
- 3 to 5+ years designing electromechanical or electro-optical assemblies, electronics or photonics packaging, or comparable high-reliability hardware
- Track record of owning designs from requirements through production
- Hands-on experience packaging electro-optical hardware, including thermal, optical-interface, and contamination challenges
- Experience designing fiber management inside constrained enclosures, including tray layout, routing, bend-radius and strain-relief strategy, splice retention, connector selection, TEC integration, and thermal isolation
- Experience integrating PCBAs, connectors, and cable or fiber interfaces into mechanical assemblies
- Experience collaborating with electrical engineers and PCB designers on dense, high-reliability boards
- Experience specifying mechanical and installation requirements for electrical harnesses
- Knowledge of ruggedized electronics and photonics design, thermal management, structural protection, vibration and shock survival, vacuum compatibility, and EMI/EMC shielding
- Experience conducting or directing supporting analyses
- Ability to define and negotiate mechanical and thermal interfaces with host vehicle and adjacent hardware engineers
- Strong 3D CAD skills; Creo/Pro-E a plus
- Command of GD&T, tolerance stack-ups, and ASME Y14.5 drawing practice
- Eligibility to obtain and maintain a U.S. government security clearance
- U.S. citizenship or nationality, U.S. permanent residency, or lawful admission to the U.S. as a refugee or asylee for export-control compliance
- Comfort making defensible technical decisions amid evolving requirements
- Active U.S. government security clearance and/or M.S. in a relevant discipline preferred
- Bonus experience with optical communications hardware, laser communications, hosted payloads, spacecraft environmental standards, fiber-optic standards and processes, FEA/thermal simulation, ECAD/PLM tools, qualification and reliability standards, radiation-tolerant parts, contamination control, and extreme-environment spacecraft hardware
Benefits
Comp & perks- Medical, dental, vision, basic and supplemental life insurance
- Paid parental leave
- Short- and long-term disability
- 401(k) with a company match of up to 5%
- Education Support Program
- Stock Options for all regular employees (working at least 20 hours/week)
- Up to four (4) weeks of paid time off per year based on weekly scheduled hours
- Up to 14 company-paid holidays
- Potential benefits and bonuses based on role type, job level, individual contributions, and company results (not guaranteed)
ATS Keywords
✓ Tailor your resumeApplicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills
Mechanical EngineeringThermal DesignElectro-Optical DesignFiber Management DesignPCB IntegrationTolerance Stack-Up AnalysisDFM/DFAEnvironmental TestingOptical Interface DesignContamination Control
Soft Skills
CollaborationMentoringDecision-MakingProblem-SolvingCommunication
Tools & Technologies
Creo/Pro-EECAD/MCAD ToolsThermal Simulation SoftwarePLM Tools
Certifications & Qualifications
U.S. Government Security Clearance
Industry Keywords
Electromechanical AssembliesPhotonics PackagingHigh-Reliability HardwareEMI/EMC ShieldingRuggedized ElectronicsSpacecraft Environmental StandardsFiber-Optic StandardsQualification and Reliability Standards