Senior Electromechanical Packaging Engineer – Electro-Optical Components
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Senior Electromechanical Packaging Engineer – Electro-Optical Components
BLUE ORIGINPosted 10/22/2026full-timeDenver • Colorado • United StatesSenior💰 $144,179 - $201,850 per yearWebsite
Core Competencies
Role fitCore Competencies
Use this summary to align your resume positioning with the role.
Demonstrates expertise in mechanical and thermal design of electro-optical assemblies, with a strong focus on packaging, thermal management, and integration of complex systems. Proficient in collaborating with cross-functional teams and leading design reviews while ensuring compliance with industry standards.
Highest-signal resume keywords
Mechanical DesignThermal ManagementElectro-Optical Packaging3D CAD SkillsGD&T Expertise
Tech Stack
Tools & technologiesAbout the role
Key responsibilities & impact- Own complex packaging assemblies including enclosures, chassis, card-cage and stacked-unit architectures, mounting systems, and fiber junction housings through requirements, design, production, and support
- Lead mechanical and thermal design of modem processing and photonics units, integrating digital boards, photonics boards, electro-optic daughter cards, and power conversion slices
- Package optical amplifier and transceiver hardware, addressing optical power handling, fiber end-face reliability, hermeticity, and moisture control
- Own thermal paths, heat rejection, mounting materials, heater placement, thermal isolation, and thermal control of lasers, modulators, and TEC-cooled devices
- Design fiber-optic trays and internal fiber management, including routing, bend-radius control, strain relief, splice retention, and connector selection
- Define splicing, workmanship, fiber, optical assembly, and electrical harness processes and requirements
- Collaborate with electrical engineers and PCB designers from architecture through layout, fabrication, and test
- Drive ECAD/MCAD co-design, board floor planning, heat-source placement, connector location, component selection, and board-level protection
- Lead thermal, structural, vibration, shock, fatigue, tolerance stack-up, and thermo-elastic stability analyses
- Lead trade studies balancing mass, thermal and structural performance, EMI/EMC, manufacturability, cost, schedule, and risk
- Own mechanical, thermal, environmental, EMC, mass, and envelope requirements; maintain traceability and report mass properties
- Negotiate host vehicle accommodation and interfaces, including mounting, mass, center-of-gravity envelopes, thermal limits, and dynamic environments
- Deliver models, drawings, specifications, release packages, and mechanical and thermal ICDs using GD&T and ASME Y14.5
- Address contamination control, outgassing, hermeticity, radiation-induced fiber attenuation, radiation, and reliability risks
- Design for production using DFM/DFA and partner with suppliers on producibility
- Support testing and integration, including fixtures, optical loopback setups, environmental test campaigns, and anomaly closeout
- Mentor engineers, lead design reviews, and build team capability
- Protect classified information and controlled technical data in accordance with security requirements
Requirements
What you’ll need- B.S. in Mechanical, Aerospace, Optical, or Photonics Engineering, or a related discipline
- 5-10+ years designing electromechanical or electro-optical assemblies, electronics or photonics packaging, or comparable high-reliability hardware
- Track record of owning designs from requirements through production
- Hands-on experience packaging electro-optical hardware, including thermal, optical-interface, and contamination challenges
- Experience designing fiber management inside constrained enclosures, including tray layout, routing, bend-radius and strain-relief strategy, splice retention, and connector selection
- Experience with thermal management of temperature-sensitive photonics, including TEC integration and thermal isolation
- Experience integrating PCBAs, connectors, and cable or fiber interfaces into mechanical assemblies
- Experience collaborating with electrical engineers and PCB designers on dense, high-reliability boards
- Experience specifying mechanical and installation requirements for electrical harnesses
- Knowledge of ruggedized electronics and photonics design, thermal management, structural protection, vibration and shock survival, vacuum compatibility, and EMI/EMC shielding
- Experience conducting or directing supporting analyses
- Ability to define and hold mechanical and thermal interfaces with host vehicles and adjacent hardware
- Strong 3D CAD skills; Creo/Pro-E a plus
- Command of GD&T, tolerance stack-ups, and ASME Y14.5 drawing practice
- Eligibility to obtain and maintain a U.S. government security clearance
- U.S. citizenship or nationality, U.S. permanent residency, or lawful admission to the U.S. as a refugee or asylee
- Comfort making defensible technical decisions amid evolving requirements
- M.S. in a relevant discipline is preferred
- Active U.S. government security clearance is preferred
- Bonus experience with optical communications hardware, laser communications terminal architecture, hosted payloads, spacecraft environmental specifications, fiber-optic standards and processes, ANSYS, FloTHERM, Altium, Mentor xPedition, Windchill, qualification and reliability standards, and space or extreme-environment hardware
Benefits
Comp & perks- Medical insurance
- Dental insurance
- Vision insurance
- Basic and supplemental life insurance
- Paid parental leave
- Short- and long-term disability
- 401(k) with a company match of up to 5%
- Education Support Program
- Stock Options for all regular employees working at least 20 hours/week
- Up to four weeks of paid time off per year based on weekly scheduled hours
- Up to 14 company-paid holidays
- Potential benefits and bonuses based on role type, job level, individual contributions, and company results
ATS Keywords
✓ Tailor your resumeApplicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills
Mechanical EngineeringThermal DesignElectro-Optical AssembliesFiber ManagementPCB IntegrationContamination ControlTolerance Stack-UpDFM/DFAReliability AnalysisEMI/EMC Shielding
Soft Skills
LeadershipCollaborationMentoringDecision-MakingCommunication
Tools & Technologies
CreoANSYSFloTHERMAltiumMentor xPeditionWindchill
Certifications & Qualifications
U.S. Government Security Clearance
Industry Keywords
High-Reliability HardwareOptical CommunicationsSpacecraft Environmental SpecificationsRuggedized ElectronicsThermal Isolation