Applied Materials

Engineer

• Develop and optimize die-to-wafer hybrid bonding processes for advanced packaging applications
• Establish process windows for surface preparation, plasma activation, die placement, alignment and overlay control, bonding temperature and pressure, and post-bond annealing
• Drive Cu-Cu and dielectric-dielectric interconnect formation for electrical performance and reliability
• Support integration into memory architectures, chiplet-based systems, silicon interposers, system-on-wafer platforms, and co-packaged optics
• Resolve process interactions and yield excursions with integration teams
• Identify root causes of bond voids, die shift, overlay errors, non-uniform bonding, and particle contamination
• Use DOE methodologies and statistical process control to improve yield and robustness
• Characterize bonding quality using CSAM, X-ray inspection, FIB/SEM, AFM, optical metrology, and electrical test structures
• Develop correlations between process parameters and package performance
• Collaborate with equipment engineering teams on hybrid bonding systems, die placement tools, plasma activation modules, surface preparation modules, and integrated process control solutions
• Evaluate and qualify next-generation bonding platforms
• Define and execute reliability tests including thermal cycling, HTOL, mechanical pull/shear testing, and moisture sensitivity evaluations
• Drive failure analysis and corrective actions
• Lead cross-functional projects from concept through technology transfer
• Publish technical results internally and externally
• Present development progress to engineering leadership and customers
• Mentor junior engineers and researchers

Senior Module Engineer, Hybrid Bonding

• Lead development and integration of advanced packaging technologies focused on Hybrid Bonding for Logic, Memory, and 3D heterogeneous integration
• Develop and optimize end-to-end Hybrid Bonding processes, including surface preparation, cleaning, plasma activation, dielectric-to-dielectric bonding, Cu-Cu direct bonding, and post-bond annealing
• Design and execute process characterization and DOE studies to establish process windows and improve bonding metrics
• Investigate and resolve process integration challenges through data-driven root cause analysis
• Collaborate with equipment, materials, metrology, and integration teams on scalable die-to-wafer Hybrid Bonding solutions
• Define and implement characterization methodologies using optical inspection, IR imaging, SEM, AFM, XPS, contact angle measurement, electrical testing, and reliability evaluation
• Support HBM, Logic, TSV, RDL, and die-to-wafer bonding technology development
• Engage customers, research institutes, and ecosystem partners on joint technology development projects
• Generate technical reports, patents, publications, and technology roadmaps
• Collect and analyze data, perform hardware characterization, troubleshoot engineering issues, measure film properties, and generate technical documentation

Technology Development Process Engineer – Hybrid Bonding, Advanced Packaging

Auditor

• Execute audit programs within defined project timelines, addressing complex, high-risk areas with limited supervision
• Participate in planning operational audits and advisory projects, including regional audits, process reviews, and supplier audits
• Conduct process interviews and walkthroughs, document key attributes, and support junior auditors during planning
• Perform audit fieldwork in accordance with IIA standards
• Apply RACI frameworks, design testing attributes, complete work papers, and maintain quality and re-performance standards
• Contribute to audit methodologies and templates and recommend scope adjustments
• Identify control gaps, risks, and improvement opportunities
• Review methodology, evidence, and conclusions with the Project Manager
• Draft findings, consolidate reports, and present findings to stakeholders, project teams, and the CAE
• Support junior team members in issue resolution
• Maintain work papers, scope documentation, and project records in Optro
• Track management action plans and follow-up actions through audit closure in Optro
• Monitor remediation, validate corrective actions, gather evidence, and provide status updates to the Project Manager and CAE
• Lead small-scale operational audits or advisory projects
• Support SOX testing, IT projects, investigations, and other ad hoc cross-pillar initiatives

Senior Internal Auditor

QA Engineer

• Analyze field service data, customer feedback, equipment performance trends, and recurring issue patterns
• Lead root-cause investigations and corrective actions for recurring product and service issues
• Partner with field service, engineering, manufacturing, customer quality, supplier quality, and business unit teams to resolve complex technical problems
• Improve service documentation, lessons learned, and knowledge assets
• Develop and track quality metrics, dashboards, and action plans
• Support customer escalations through technical analysis, structured problem solving, and cross-functional issue resolution
• Drive lessons learned, best practices, and knowledge reuse across the organization
• Develop field quality capabilities through quality training, coaching, and promotion of consistent quality processes
• Support product introductions, ramp readiness activities, and field reliability improvement initiatives
• Promote quality culture, first-time-right behaviors, issue ownership, and continuous improvement within the field organization

Field Quality Engineer – IV

Support Engineer

• Understand and resolve Applied Materials’ equipment software application and systems issues of low complexity with some supervision
• Provide customer software support via the Software Ticketing system
• Assist in analyzing software issues reported on customer tools by field engineers
• Align and deliver work in line with group objectives
• Develop beginner-level understanding of BU products, system software, troubleshooting tools/BKMs, and infrastructure
• Complete company-level trainings and certifications for specific product knowledge
• Become familiar with equipment software documentation, key customer features, and software product release installation/upgrade instructions
• Develop technical contributions without supervisory responsibilities

Global Software Support Engineer

Implementation Specialist

• Serve as the direct liaison with customers
• Install, maintain, and upgrade customer equipment
• Apply basic diagnostic techniques to assess equipment and address technical issues with assistance from Senior Field Service Engineers
• Collaborate with Senior Field Service Engineers and/or customers to understand roadmaps, process flows, inflection points, requirements, and business challenges
• Train and mentor junior Field Service Engineers
• Perform preventative and corrective maintenance on electrical, vacuum, mechanical, plasma, hydraulic, and gas systems
• Coordinate and communicate directly with customers
• Fulfill additional assigned duties
• Support the TESLA Terra FAB opening in Austin, Texas
• Travel up to 20% initially for candidates residing in Arizona or Oregon; extensive travel for candidates outside Arizona/Oregon through site completion
• Relocate to Austin upon site completion

Senior Module Engineer, Hybrid Bonding

Technology Development Process Engineer – Hybrid Bonding, Advanced Packaging

Senior Internal Auditor

Field Quality Engineer – IV

Global Software Support Engineer

Customer Engineer, C3/C4