Engineer jobs in United States

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Nokia

Staff Process Engineer – Thin Film & Metal Deposition

Nokia

Posted: 10/21/2026
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General Motors

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Nokia

Staff Process Engineer – Thin Film & Metal Deposition

Nokia
Posted 10/21/2026full-timeSunnyvale • California • United StatesLead💰 $139,000 - $198,000 per yearWebsite
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Core Competencies

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Core Competencies

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Demonstrates expertise in thin film deposition and metallization processes for photonic integrated circuits, with a strong focus on process optimization, defect reduction, and yield improvement. Proficient in utilizing advanced analytics and statistical process control to enhance manufacturing performance in a semiconductor environment.

Highest-signal resume keywords
Thin Film DepositionMetallization ProcessesStatistical Process Control (SPC)Design of Experiments (DOE)Vacuum Systems

About the role

Key responsibilities & impact
  • Develop, qualify, and sustain thin film and metallization processes supporting InP photonic integrated circuit manufacturing
  • Own and optimize deposition processes including PECVD, PVD sputtering, evaporation, electroplating, and other vacuum-based deposition technologies
  • Support deposition of dielectric and metallic optical and electrical functional films
  • Lead electrochemical deposition process development, including plating chemistry control, bath maintenance, current density optimization, deposition rate control, thickness uniformity, stress management, and defect reduction
  • Optimize film thickness, within-wafer uniformity, refractive index, stress, adhesion, sheet resistance, contact resistance, composition, and defectivity
  • Develop metallization processes for lasers, modulators, SOAs, photodiodes, RF structures, and passive optical components
  • Drive defect reduction, yield improvement, and process capability enhancement using DOE, SPC, advanced analytics, and statistical process control
  • Perform root-cause analysis and corrective actions for process excursions, film quality issues, equipment failures, and integration challenges
  • Analyze processes using first-principles, physics-based methods
  • Collaborate with lithography, wet etch, dry etch, device engineering, integration, reliability, and manufacturing teams
  • Lead evaluations of new materials, process technologies, deposition hardware, and equipment upgrades
  • Partner with equipment vendors and material suppliers on chamber matching, hardware improvements, reliability enhancements, and cost-of-ownership initiatives
  • Support technology transfer from development into production
  • Provide rapid response and technical leadership during process excursions and production-impacting events
  • Support a 24x7 manufacturing environment through escalation, troubleshooting, and on-call support when required
  • Use AI-enabled engineering tools, automation, and advanced data analytics to improve process development and manufacturing performance

Requirements

What you’ll need
  • M.S. or Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, Physics, Chemistry, or a related technical discipline
  • B.S. degree with 5+ years of semiconductor, photonics, or advanced manufacturing experience will also be considered
  • Strong experience in thin film deposition, metallization, and related semiconductor fabrication processes
  • Experience with semiconductor process development, integration, yield improvement, and production support
  • Working knowledge of vacuum systems, deposition equipment, process control methodologies, and materials characterization techniques
  • Demonstrated experience using DOE, SPC, JMP, statistical analysis, and data-driven problem solving
  • Strong ownership mindset with demonstrated ability to drive projects independently and deliver measurable business impact
  • Excellent troubleshooting and root-cause analysis skills
  • Ability to prioritize effectively and respond quickly to manufacturing challenges
  • Strong communication and collaboration skills in cross-functional technical environments
  • Familiarity with AI-enabled engineering tools and modern data analytics methods
  • Hands-on experience with PECVD, PVD sputtering, e-beam evaporation, thermal evaporation, electroplating, ALD, or related deposition technologies
  • Experience with InP, GaAs, silicon photonics, III-V semiconductors, and optical device manufacturing
  • Understanding of optical device requirements including film stress control, refractive index control, optical loss reduction, adhesion, and long-term reliability
  • Experience developing Au-based metallization systems for photonic and optoelectronic devices
  • Familiarity with semiconductor characterization techniques including ellipsometry, profilometry, four-point probe, SEM, AFM, XRF, XRD, and film stress measurements
  • Experience with new equipment acceptance, qualification, process transfer, and factory ramp activities
  • Experience supporting high-volume manufacturing environments
  • Experience collaborating with equipment suppliers and technology partners on joint development activities
  • Passion for manufacturing excellence and continuous improvement
  • Proven success balancing long-term technology development objectives with urgent production support requirements

Benefits

Comp & perks
  • Laptop support with ordering
  • Hybrid work arrangement
  • On-call support compensation may apply (not explicitly stated)

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills
PECVDPVD SputteringElectroplatingE-Beam EvaporationThermal EvaporationAtomic Layer Deposition (ALD)Materials Characterization TechniquesRoot-Cause AnalysisProcess DevelopmentYield Improvement
Soft Skills
Strong CommunicationCollaboration SkillsOwnership MindsetTroubleshooting SkillsAbility to Prioritize
Tools & Technologies
AI-Enabled Engineering ToolsJMPData Analytics MethodsVacuum-Based Deposition TechnologiesSemiconductor Characterization Techniques
Industry Keywords
SemiconductorPhotonicsOptoelectronic DevicesInPGaAsIII-V SemiconductorsOptical Device ManufacturingManufacturing ExcellenceContinuous ImprovementHigh-Volume Manufacturing